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preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 1 www.silabs.com efm32hg108 datasheet f64/f32 preliminary ? arm cortex-m0+ cpu platform ? high performance 32-bit processor @ up to 25 mhz ? wake-up interrupt controller ? flexible energy management system ? 20 na @ 3 v shutoff mode ? 0.6 a @ 3 v stop mode, including power-on reset, brown-out detector, ram and cpu retention ? 0.9 a @ 3 v deep sleep mode, including rtc with 32.768 khz oscillator, power-on reset, brown-out detector, ram and cpu retention ? 53 a/mhz @ 3 v sleep mode ? 132 a/mhz @ 3 v run mode, with code executed from flash ? 64/32 kb flash ? 8/4 kb ram ? 17 general purpose i/o pins ? configurable push-pull, open-drain, pull-up/down, input filter, drive strength ? configurable peripheral i/o locations ? 11 asynchronous external interrupts ? output state retention and wake-up from shutoff mode ? 6 channel dma controller ? 6 channel peripheral reflex system (prs) for autonomous in- ter-peripheral signaling ? timers/counters ? 3 16-bit timer/counter ? 33 compare/capture/pwm channels ? dead-time insertion on timer0 ? 1 24-bit real-time counter ? 1 16 -bit pulse counter ? watchdog timer with dedicated rc oscillator @ 50 na ? communication interfaces ? 2 universal synchronous/asynchronous receiv- er/transmitter ? uart/spi/smartcard (iso 7816) /irda /i2s ? triple buffered full/half-duplex operation ? low energy uart ? autonomous operation with dma in deep sleep mode ? i 2 c interface with smbus support ? address recognition in stop mode ? ultra low power precision analog peripherals ? 1 analog comparator ? capacitive sensing with up to 2 inputs ? supply voltage comparator ? ultra efficient power-on reset and brown-out detec- tor ? debug interface ? 2-pin serial wire debug interface ? micro trace buffer (mtb) ? pre-programmed uart bootloader ? temperature range -40 to 85 oc ? single power supply 1.98 to 3.8 v ? qfn24 package ? preliminary - this datasheet revision applies to a product under development 32-bit arm cortex-m0+, cortex-m3 and cortex-m4 microcontrollers for: ? energy, gas, water and smart metering ? health and fitness applications ? smart accessories ? alarm and security systems ? industrial and home automation
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 2 www.silabs.com 1 ordering information table 1.1 (p. 2 ) shows the available efm32hg108 devices. table 1.1. ordering information ordering code flash (kb) ram (kb) max speed (mhz) supply voltage (v) temperature (oc) package EFM32HG108F32G-A-QFN24 32 4 25 1.98 - 3.8 -40 - 85 qfn24 efm32hg108f64g-a-qfn24 64 8 25 1.98 - 3.8 -40 - 85 qfn24 adding the suffix 'r' to the part number (e.g. EFM32HG108F32G-A-QFN24r) denotes tape and reel. visit www.silabs.com for information on global distributors and representatives.
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 3 www.silabs.com 2 system summary 2.1 system introduction the efm32 mcus are the world?s most energy friendly microcontrollers. with a unique combination of the powerful 32-bit arm cortex-m0+, innovative low energy techniques, short wake-up time from energy saving modes, and a wide selection of peripherals, the efm32hg microcontroller is well suited for any battery operated application as well as other systems requiring high performance and low-energy consumption. this section gives a short introduction to each of the modules in general terms and also shows a summary of the configuration for the efm32hg108 devices. for a complete feature set and in-depth information on the modules, the reader is referred to the efm32hg reference manual . a block diagram of the efm32hg108 is shown in figure 2.1 (p. 3 ) . figure 2.1. block diagram clock managem ent energy managem ent serial interfaces i/ o ports core and mem ory tim ers and triggers 32- bit bus peripheral reflex system arm cortex ? m0+ processor flash program mem ory pulse counter watchdog tim er ram mem ory general purpose i/ o ex ternal interrupts pin reset hg108f64/ f32 usart i 2 c power- on reset voltage regulator voltage com parator brown- out detector tim er/ counter real tim e counter low energy uart? debug interface w/ mtb high freq crystal oscillator low freq crystal oscillator low freq rc oscillator ultra low freq rc oscillator high freq rc oscillator 48/ 24 mhz com m . rc oscillator aux high freq rc oscillator pin wakeup analog interfaces security dma controller analog com parator 2.1.1 arm cortex-m0+ core the arm cortex-m0+ includes a 32-bit risc processor which can achieve as much as 0.9 dhrystone mips/mhz. a wake-up interrupt controller handling interrupts triggered while the cpu is asleep is in- cluded as well . the efm32 implementation of the cortex-m0+ is described in detail in arm cortex-m0+ devices generic user guide . 2.1.2 debug interface (dbg) this device includes hardware debug support through a 2-pin serial-wire debug interface and a micro trace buffer (mtb) for data/instruction tracing . 2.1.3 memory system controller (msc) the memory system controller (msc) is the program memory unit of the efm32hg microcontroller. the flash memory is readable and writable from both the cortex-m0+ and dma . the flash memory is divided into two blocks; the main block and the information block. program code is normally written to the main block. additionally, the information block is available for special user data and flash lock bits.
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 4 www.silabs.com there is also a read-only page in the information block containing system and device calibration data. read and write operations are supported in the energy modes em0 and em1. 2.1.4 direct memory access controller (dma) the direct memory access (dma) controller performs memory operations independently of the cpu. this has the benefit of reducing the energy consumption and the workload of the cpu, and enables the system to stay in low energy modes when moving for instance data from the usart to ram or from the external bus interface to a pwm-generating timer. the dma controller uses the pl230 dma controller licensed from arm. 2.1.5 reset management unit (rmu) the rmu is responsible for handling the reset functionality of the efm32hg. 2.1.6 energy management unit (emu) the energy management unit (emu) manage all the low energy modes (em) in efm32hg microcon- trollers. each energy mode manages if the cpu and the various peripherals are available. the emu can also be used to turn off the power to unused sram blocks. 2.1.7 clock management unit (cmu) the clock management unit (cmu) is responsible for controlling the oscillators and clocks on-board the efm32hg. the cmu provides the capability to turn on and off the clock on an individual basis to all peripheral modules in addition to enable/disable and configure the available oscillators. the high degree of flexibility enables software to minimize energy consumption in any specific application by not wasting power on peripherals and oscillators that are inactive. 2.1.8 watchdog (wdog) the purpose of the watchdog timer is to generate a reset in case of a system failure, to increase appli- cation reliability. the failure may e.g. be caused by an external event, such as an esd pulse, or by a software failure. 2.1.9 peripheral reflex system (prs) the peripheral reflex system (prs) system is a network which lets the different peripheral module communicate directly with each other without involving the cpu. peripheral modules which send out reflex signals are called producers. the prs routes these reflex signals to consumer peripherals which apply actions depending on the data received. the format for the reflex signals is not given, but edge triggers and other functionality can be applied by the prs. 2.1.10 inter-integrated circuit interface (i2c) the i 2 c module provides an interface between the mcu and a serial i 2 c-bus. it is capable of acting as both a master and a slave, and supports multi-master buses. both standard-mode, fast-mode and fast- mode plus speeds are supported, allowing transmission rates all the way from 10 kbit/s up to 1 mbit/s. slave arbitration and timeouts are also provided to allow implementation of an smbus compliant system. the interface provided to software by the i 2 c module, allows both fine-grained control of the transmission process and close to automatic transfers. automatic recognition of slave addresses is provided in all energy modes. 2.1.11 universal synchronous/asynchronous receiver/transmitter (us- art) the universal synchronous asynchronous serial receiver and transmitter (usart) is a very flexible serial i/o module. it supports full duplex asynchronous uart communication as well as rs-485, spi, microwire and 3-wire. it can also interface with iso7816 smartcards, irda and i2s devices.
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 5 www.silabs.com 2.1.12 pre-programmed uart bootloader the bootloader presented in application note an0003 is pre-programmed in the device at factory. auto- baud and destructive write are supported. the autobaud feature, interface and commands are described further in the application note. 2.1.13 low energy universal asynchronous receiver/transmitter (leuart) the unique leuart tm , the low energy uart, is a uart that allows two-way uart communication on a strict power budget. only a 32.768 khz clock is needed to allow uart communication up to 9600 baud/ s. the leuart includes all necessary hardware support to make asynchronous serial communication possible with minimum of software intervention and energy consumption. 2.1.14 timer/counter (timer) the 16-bit general purpose timer has 3 compare/capture channels for input capture and compare/pulse- width modulation (pwm) output. timer0 also includes a dead-time insertion module suitable for motor control applications. 2.1.15 real time counter (rtc) the real time counter (rtc) contains a 24-bit counter and is clocked either by a 32.768 khz crystal oscillator, or a 32.768 khz rc oscillator. in addition to energy modes em0 and em1, the rtc is also available in em2. this makes it ideal for keeping track of time since the rtc is enabled in em2 where most of the device is powered down. 2.1.16 pulse counter (pcnt) the pulse counter (pcnt) can be used for counting pulses on a single input or to decode quadrature encoded inputs. it runs off either the internal lfaclk or the pcntn_s0in pin as external clock source. the module may operate in energy mode em0 - em3. 2.1.17 analog comparator (acmp) the analog comparator is used to compare the voltage of two analog inputs, with a digital output indi- cating which input voltage is higher. inputs can either be one of the selectable internal references or from external pins. response time and thereby also the current consumption can be configured by altering the current supply to the comparator. 2.1.18 voltage comparator (vcmp) the voltage supply comparator is used to monitor the supply voltage from software. an interrupt can be generated when the supply falls below or rises above a programmable threshold. response time and thereby also the current consumption can be configured by altering the current supply to the comparator. 2.1.19 general purpose input/output (gpio) in the efm32hg108, there are 17 general purpose input/output (gpio) pins, which are divided into ports with up to 16 pins each. these pins can individually be configured as either an output or input. more advanced configurations like open-drain, filtering and drive strength can also be configured individually for the pins. the gpio pins can also be overridden by peripheral pin connections, like timer pwm outputs or usart communication, which can be routed to several locations on the device. the gpio supports up to 11 asynchronous external pin interrupts, which enables interrupts from any pin on the device. also, the input value of a pin can be routed through the peripheral reflex system to other peripherals.
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 6 www.silabs.com 2.2 configuration summary the features of the efm32hg108 is a subset of the feature set described in the efm32hg reference manual. table 2.1 (p. 6 ) describes device specific implementation of the features. table 2.1. configuration summary module configuration pin connections cortex-m0+ full configuration na dbg full configuration dbg_swclk, dbg_swdio, msc full configuration na dma full configuration na rmu full configuration na emu full configuration na cmu full configuration cmu_out0, cmu_out1 wdog full configuration na prs full configuration na i2c0 full configuration i2c0_sda, i2c0_scl usart0 full configuration with irda and i2s us0_tx, us0_rx. us0_clk, us0_cs usart1 full configuration with i2s and irda us1_tx, us1_rx, us1_clk, us1_cs leuart0 full configuration leu0_tx, leu0_rx timer0 full configuration with dti tim0_cc[2:0] , tim0_cdti[2:0] timer1 full configuration tim1_cc[2:0] timer2 full configuration tim2_cc[2:0] rtc full configuration na pcnt0 full configuration, 16-bit count register pcnt0_s[1:0] acmp0 full configuration acmp0_ch[1:0], acmp0_o vcmp full configuration na gpio 17 pins available pins are shown in table 4.3 (p. 40 ) 2.3 memory map the efm32hg108 memory map is shown in figure 2.2 (p. 7 ) , with ram and flash sizes for the largest memory configuration.
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 7 www.silabs.com figure 2.2. efm32hg108 memory map with largest ram and flash sizes
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 8 www.silabs.com 3 electrical characteristics 3.1 test conditions 3.1.1 typical values the typical data are based on t amb =25c and v dd =3.0 v, as defined in table 3.2 (p. 8 ) , by simu- lation and/or technology characterisation unless otherwise specified. 3.1.2 minimum and maximum values the minimum and maximum values represent the worst conditions of ambient temperature, supply volt- age and frequencies, as defined in table 3.2 (p. 8 ) , by simulation and/or technology characterisa- tion unless otherwise specified. 3.2 absolute maximum ratings the absolute maximum ratings are stress ratings, and functional operation under such conditions are not guaranteed. stress beyond the limits specified in table 3.1 (p. 8 ) may affect the device reliability or cause permanent damage to the device. functional operating conditions are given in table 3.2 (p. 8 ) . table 3.1. absolute maximum ratings symbol parameter condition min typ max unit t stg storage tempera- ture range -40 150 1 c t s maximum soldering temperature latest ipc/jedec j-std-020 standard 260 c v ddmax external main sup- ply voltage 0 3.8 v v iopin voltage on any i/o pin -0.3 v dd +0.3 v 1 based on programmed devices tested for 10000 hours at 150oc. storage temperature affects retention of preprogrammed cal- ibration values stored in flash. please refer to the flash section in the electrical characteristics for information on flash data re- tention for different temperatures. 3.3 general operating conditions 3.3.1 general operating conditions table 3.2. general operating conditions symbol parameter min typ max unit t amb ambient temperature range -40 85 c v ddop operating supply voltage 1.98 3.8 v f apb internal apb clock frequency 25 mhz f ahb internal ahb clock frequency 25 mhz
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 9 www.silabs.com 3.4 current consumption table 3.3. current consumption symbol parameter condition min typ max unit 24 mhz hfxo, all peripheral clocks disabled, v dd = 3.0 v, t amb =25c 148 158 a/ mhz 24 mhz hfxo, all peripheral clocks disabled, v dd = 3.0 v, t amb =85c 153 163 a/ mhz 21 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =25c 132 140 a/ mhz 21 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =85c 134 143 a/ mhz 14 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =25c 134 143 a/ mhz 14 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =85c 137 145 a/ mhz 11 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =25c 136 144 a/ mhz 11 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =85c 139 148 a/ mhz 6.6 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =25c 142 150 a/ mhz 6.6 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =85c 146 154 a/ mhz 1.2 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =25c 184 196 a/ mhz i em0 em0 current. no prescaling. running prime number cal- culation code from flash. 1.2 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =85c 194 208 a/ mhz 24 mhz hfxo, all peripheral clocks disabled, v dd = 3.0 v, t amb =25c 64 68 a/ mhz 24 mhz hfxo, all peripheral clocks disabled, v dd = 3.0 v, t amb =85c 67 71 a/ mhz 21 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =25c 53 57 a/ mhz i em1 em1 current 21 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =85c 54 58 a/ mhz
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 10 www.silabs.com symbol parameter condition min typ max unit 14 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =25c 56 59 a/ mhz 14 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =85c 57 61 a/ mhz 11 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =25c 58 61 a/ mhz 11 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =85c 59 63 a/ mhz 6.6 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =25c 64 68 a/ mhz 6.6 mhz hfrco, all peripher- al clocks disabled, v dd = 3.0 v, t amb =85c 67 71 a/ mhz 1.2 mhz hfrco. all peripher- al clocks disabled, v dd = 3.0 v, t amb =25c 106 114 a/ mhz 1.2 mhz hfrco. all peripher- al clocks disabled, v dd = 3.0 v, t amb =85c 114 126 a/ mhz em2 current with rtc prescaled to 1 hz, 32.768 khz lfrco, v dd = 3.0 v, t amb =25c 0.9 1.35 a i em2 em2 current em2 current with rtc prescaled to 1 hz, 32.768 khz lfrco, v dd = 3.0 v, t amb =85c 1.6 3.50 a em3 current (ulfrco en- abled, lfrco/lfxo disabled), v dd = 3.0 v, t amb =25c 0.6 0.90 a i em3 em3 current em3 current (ulfrco en- abled, lfrco/lfxo disabled), v dd = 3.0 v, t amb =85c 1.2 2.65 a v dd = 3.0 v, t amb =25c 0.02 0.035 a i em4 em4 current v dd = 3.0 v, t amb =85c 0.18 0.480 a
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 11 www.silabs.com 3.4.1 em0 current consumption figure 3.1. em0 current consumption while executing prime number calculation code from flash with hfrco running at 24 mhz 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 2.68 2.70 2.72 2.74 2.76 2.78 2.80 2.82 2.84 idd [m a] - 40.0c - 15.0c 5.0c 25.0c 45.0c 65.0c 85.0c ?40 ?15 5 25 45 65 85 tem perature [c] 2.68 2.70 2.72 2.74 2.76 2.78 2.80 2.82 2.84 idd [m a] vdd= 2.0v vdd= 2.2v vdd= 2.4v vdd= 2.6v vdd= 2.8v vdd= 3.0v vdd= 3.2v vdd= 3.4v vdd= 3.6v vdd= 3.8v figure 3.2. em0 current consumption while executing prime number calculation code from flash with hfrco running at 21 mhz 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 2.30 2.35 2.40 2.45 idd [m a] - 40.0c - 15.0c 5.0c 25.0c 45.0c 65.0c 85.0c ?40 ?15 5 25 45 65 85 tem perature [c] 2.30 2.35 2.40 2.45 idd [m a] vdd= 2.0v vdd= 2.2v vdd= 2.4v vdd= 2.6v vdd= 2.8v vdd= 3.0v vdd= 3.2v vdd= 3.4v vdd= 3.6v vdd= 3.8v
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 12 www.silabs.com figure 3.3. em0 current consumption while executing prime number calculation code from flash with hfrco running at 14 mhz 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 1.54 1.56 1.58 1.60 1.62 1.64 1.66 1.68 idd [m a] - 40.0c - 15.0c 5.0c 25.0c 45.0c 65.0c 85.0c ?40 ?15 5 25 45 65 85 tem perature [c] 1.54 1.56 1.58 1.60 1.62 1.64 1.66 1.68 idd [m a] vdd= 2.0v vdd= 2.2v vdd= 2.4v vdd= 2.6v vdd= 2.8v vdd= 3.0v vdd= 3.2v vdd= 3.4v vdd= 3.6v vdd= 3.8v figure 3.4. em0 current consumption while executing prime number calculation code from flash with hfrco running at 11 mhz 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 1.22 1.24 1.26 1.28 1.30 1.32 1.34 idd [m a] - 40.0c - 15.0c 5.0c 25.0c 45.0c 65.0c 85.0c ?40 ?15 5 25 45 65 85 tem perature [c] 1.22 1.24 1.26 1.28 1.30 1.32 1.34 idd [m a] vdd= 2.0v vdd= 2.2v vdd= 2.4v vdd= 2.6v vdd= 2.8v vdd= 3.0v vdd= 3.2v vdd= 3.4v vdd= 3.6v vdd= 3.8v
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 13 www.silabs.com figure 3.5. em0 current consumption while executing prime number calculation code from flash with hfrco running at 6.6 mhz 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 0.77 0.78 0.79 0.80 0.81 0.82 0.83 0.84 idd [m a] - 40.0c - 15.0c 5.0c 25.0c 45.0c 65.0c 85.0c ?40 ?15 5 25 45 65 85 tem perature [c] 0.77 0.78 0.79 0.80 0.81 0.82 0.83 0.84 idd [m a] vdd= 2.0v vdd= 2.2v vdd= 2.4v vdd= 2.6v vdd= 2.8v vdd= 3.0v vdd= 3.2v vdd= 3.4v vdd= 3.6v vdd= 3.8v 3.4.2 em1 current consumption figure 3.6. em1 current consumption with all peripheral clocks disabled and hfrco running at 24 mhz 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 1.10 1.12 1.14 1.16 1.18 1.20 idd [m a] - 40.0c - 15.0c 5.0c 25.0c 45.0c 65.0c 85.0c ?40 ?15 5 25 45 65 85 tem perature [c] 1.10 1.12 1.14 1.16 1.18 1.20 idd [m a] vdd= 2.0v vdd= 2.2v vdd= 2.4v vdd= 2.6v vdd= 2.8v vdd= 3.0v vdd= 3.2v vdd= 3.4v vdd= 3.6v vdd= 3.8v
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 14 www.silabs.com figure 3.7. em1 current consumption with all peripheral clocks disabled and hfrco running at 21 mhz 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 0.95 0.96 0.97 0.98 0.99 1.00 1.01 1.02 1.03 1.04 idd [m a] - 40.0c - 15.0c 5.0c 25.0c 45.0c 65.0c 85.0c ?40 ?15 5 25 45 65 85 tem perature [c] 0.95 0.96 0.97 0.98 0.99 1.00 1.01 1.02 1.03 1.04 idd [m a] vdd= 2.0v vdd= 2.2v vdd= 2.4v vdd= 2.6v vdd= 2.8v vdd= 3.0v vdd= 3.2v vdd= 3.4v vdd= 3.6v vdd= 3.8v figure 3.8. em1 current consumption with all peripheral clocks disabled and hfrco running at 14 mhz 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 0.66 0.67 0.68 0.69 0.70 0.71 0.72 0.73 idd [m a] - 40.0c - 15.0c 5.0c 25.0c 45.0c 65.0c 85.0c ?40 ?15 5 25 45 65 85 tem perature [c] 0.66 0.67 0.68 0.69 0.70 0.71 0.72 0.73 idd [m a] vdd= 2.0v vdd= 2.2v vdd= 2.4v vdd= 2.6v vdd= 2.8v vdd= 3.0v vdd= 3.2v vdd= 3.4v vdd= 3.6v vdd= 3.8v
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 15 www.silabs.com figure 3.9. em1 current consumption with all peripheral clocks disabled and hfrco running at 11 mhz 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 0.53 0.54 0.55 0.56 0.57 0.58 0.59 idd [m a] - 40.0c - 15.0c 5.0c 25.0c 45.0c 65.0c 85.0c ?40 ?15 5 25 45 65 85 tem perature [c] 0.53 0.54 0.55 0.56 0.57 0.58 0.59 idd [m a] vdd= 2.0v vdd= 2.2v vdd= 2.4v vdd= 2.6v vdd= 2.8v vdd= 3.0v vdd= 3.2v vdd= 3.4v vdd= 3.6v vdd= 3.8v figure 3.10. em1 current consumption with all peripheral clocks disabled and hfrco running at 6.6 mhz 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 0.350 0.355 0.360 0.365 0.370 0.375 0.380 0.385 0.390 0.395 idd [m a] - 40.0c - 15.0c 5.0c 25.0c 45.0c 65.0c 85.0c ?40 ?15 5 25 45 65 85 tem perature [c] 0.350 0.355 0.360 0.365 0.370 0.375 0.380 0.385 0.390 0.395 idd [m a] vdd= 2.0v vdd= 2.2v vdd= 2.4v vdd= 2.6v vdd= 2.8v vdd= 3.0v vdd= 3.2v vdd= 3.4v vdd= 3.6v vdd= 3.8v
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 16 www.silabs.com 3.4.3 em2 current consumption figure 3.11. em2 current consumption. rtc prescaled to 1khz, 32.768 khz lfrco. 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 idd [ua] - 40.0c - 15.0c 5.0c 25.0c 45.0c 65.0c 85.0c ?40 ?15 5 25 45 65 85 tem perature [c] 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 idd [ua] vdd= 2.0v vdd= 2.2v vdd= 2.4v vdd= 2.6v vdd= 2.8v vdd= 3.0v vdd= 3.2v vdd= 3.4v vdd= 3.6v vdd= 3.8v 3.4.4 em3 current consumption figure 3.12. em3 current consumption. 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 0.4 0.6 0.8 1.0 1.2 1.4 1.6 idd [ua] - 40.0c - 15.0c 5.0c 25.0c 45.0c 65.0c 85.0c ?40 ?15 5 25 45 65 85 tem perature [c] 0.4 0.6 0.8 1.0 1.2 1.4 1.6 idd [ua] vdd= 2.0v vdd= 2.2v vdd= 2.4v vdd= 2.6v vdd= 2.8v vdd= 3.0v vdd= 3.2v vdd= 3.4v vdd= 3.6v vdd= 3.8v
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 17 www.silabs.com 3.4.5 em4 current consumption figure 3.13. em4 current consumption. 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] ?0.1 0.0 0.1 0.2 0.3 0.4 0.5 idd [ua] - 40.0c - 15.0c 5.0c 25.0c 45.0c 65.0c 85.0c ?40 ?15 5 25 45 65 85 tem perature [c] ?0.1 0.0 0.1 0.2 0.3 0.4 0.5 idd [ua] vdd= 2.0v vdd= 2.2v vdd= 2.4v vdd= 2.6v vdd= 2.8v vdd= 3.0v vdd= 3.2v vdd= 3.4v vdd= 3.6v vdd= 3.8v 3.5 transition between energy modes the transition times are measured from the trigger to the first clock edge in the cpu. table 3.4. energy modes transitions symbol parameter min typ max unit t em10 transition time from em1 to em0 0 hf- core- clk cycles t em20 transition time from em2 to em0 2 s t em30 transition time from em3 to em0 2 s t em40 transition time from em4 to em0 163 s 3.6 power management the efm32hg requires the avdd_x, vdd_dreg and iovdd_x pins to be connected together (with optional filter) at the pcb level. for practical schematic recommendations, please see the application note, "an0002 efm32 hardware design considerations".
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 18 www.silabs.com table 3.5. power management symbol parameter condition min typ max unit v bodextthr- bod threshold on falling external sup- ply voltage 1.74 1.96 v v bodextthr+ bod threshold on rising external sup- ply voltage 1.89 v t reset delay from reset is released until program execution starts applies to power-on reset, brown-out reset and pin reset. 163 s c decouple voltage regulator decoupling capaci- tor. x5r capacitor recommended. apply between decouple pin and ground 1 f 3.7 flash table 3.6. flash symbol parameter condition min typ max unit ec flash flash erase cycles before failure 20000 cycles t amb <150c 10000 h t amb <85c 10 years ret flash flash data retention t amb <70c 20 years t w_prog word (32-bit) pro- gramming time 20 s t p_erase page erase time 20 20.4 20.8 ms t d_erase device erase time 40 40.8 41.6 ms i erase erase current 7 1 ma i write write current 7 1 ma v flash supply voltage dur- ing flash erase and write 1.98 3.8 v 1 measured at 25c 3.8 general purpose input output table 3.7. gpio symbol parameter condition min typ max unit v ioil input low voltage 0.30v dd v v ioih input high voltage 0.70v dd v sourcing 0.1 ma, v dd =1.98 v, gpio_px_ctrl drivemode = lowest 0.80v dd v v iooh output high volt- age (production test condition = 3.0v, drivemode = standard) sourcing 0.1 ma, v dd =3.0 v, gpio_px_ctrl drivemode = lowest 0.90v dd v
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 19 www.silabs.com symbol parameter condition min typ max unit sourcing 1 ma, v dd =1.98 v, gpio_px_ctrl drivemode = low 0.85v dd v sourcing 1 ma, v dd =3.0 v, gpio_px_ctrl drivemode = low 0.90v dd v sourcing 6 ma, v dd =1.98 v, gpio_px_ctrl drivemode = standard 0.75v dd v sourcing 6 ma, v dd =3.0 v, gpio_px_ctrl drivemode = standard 0.85v dd v sourcing 20 ma, v dd =1.98 v, gpio_px_ctrl drivemode = high 0.60v dd v sourcing 20 ma, v dd =3.0 v, gpio_px_ctrl drivemode = high 0.80v dd v sinking 0.1 ma, v dd =1.98 v, gpio_px_ctrl drivemode = lowest 0.20v dd v sinking 0.1 ma, v dd =3.0 v, gpio_px_ctrl drivemode = lowest 0.10v dd v sinking 1 ma, v dd =1.98 v, gpio_px_ctrl drivemode = low 0.10v dd v sinking 1 ma, v dd =3.0 v, gpio_px_ctrl drivemode = low 0.05v dd v sinking 6 ma, v dd =1.98 v, gpio_px_ctrl drivemode = standard 0.30v dd v sinking 6 ma, v dd =3.0 v, gpio_px_ctrl drivemode = standard 0.20v dd v sinking 20 ma, v dd =1.98 v, gpio_px_ctrl drivemode = high 0.35v dd v v iool output low voltage (production test condition = 3.0v, drivemode = standard) sinking 20 ma, v dd =3.0 v, gpio_px_ctrl drivemode = high 0.25v dd v i ioleak input leakage cur- rent high impedance io connected to ground or vdd 0.1 40 na r pu i/o pin pull-up resis- tor 40 kohm r pd i/o pin pull-down re- sistor 40 kohm r ioesd internal esd series resistor 200 ohm t ioglitch pulse width of puls- es to be removed 10 50 ns
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 20 www.silabs.com symbol parameter condition min typ max unit by the glitch sup- pression filter gpio_px_ctrl drivemode = lowest and load capaci- tance c l =12.5-25pf. 20+0.1c l 250 ns t ioof output fall time gpio_px_ctrl drivemode = low and load capacitance c l =350-600pf 20+0.1c l 250 ns v iohyst i/o pin hysteresis (v iothr+ - v iothr- ) v dd = 1.98 - 3.8 v 0.1v dd v
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 21 www.silabs.com figure 3.14. typical low-level output current, 2v supply voltage 0.0 0.5 1.0 1.5 2.0 low- level output voltage [v] 0.00 0.05 0.10 0.15 0.20 low- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = lowest 0.0 0.5 1.0 1.5 2.0 low- level output voltage [v] 0 1 2 3 4 5 low- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = low 0.0 0.5 1.0 1.5 2.0 low- level output voltage [v] 0 5 10 15 20 low- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = standard 0.0 0.5 1.0 1.5 2.0 low- level output voltage [v] 0 5 10 15 20 25 30 35 40 45 low- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = high
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 22 www.silabs.com figure 3.15. typical high-level output current, 2v supply voltage 0.0 0.5 1.0 1.5 2.0 high- level output voltage [v] ?0.20 ?0.15 ?0.10 ?0.05 0.00 high- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = lowest 0.0 0.5 1.0 1.5 2.0 high- level output voltage [v] ?2.5 ?2.0 ?1.5 ?1.0 ?0.5 0.0 high- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = low 0.0 0.5 1.0 1.5 2.0 high- level output voltage [v] ?20 ?15 ?10 ?5 0 high- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = standard 0.0 0.5 1.0 1.5 2.0 high- level output voltage [v] ?50 ?40 ?30 ?20 ?10 0 high- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = high
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 23 www.silabs.com figure 3.16. typical low-level output current, 3v supply voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 low- level output voltage [v] 0.0 0.1 0.2 0.3 0.4 0.5 low- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = lowest 0.0 0.5 1.0 1.5 2.0 2.5 3.0 low- level output voltage [v] 0 2 4 6 8 10 low- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = low 0.0 0.5 1.0 1.5 2.0 2.5 3.0 low- level output voltage [v] 0 5 10 15 20 25 30 35 40 low- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = standard 0.0 0.5 1.0 1.5 2.0 2.5 3.0 low- level output voltage [v] 0 10 20 30 40 50 low- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = high
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 24 www.silabs.com figure 3.17. typical high-level output current, 3v supply voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 high- level output voltage [v] ?0.5 ?0.4 ?0.3 ?0.2 ?0.1 0.0 high- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = lowest 0.0 0.5 1.0 1.5 2.0 2.5 3.0 high- level output voltage [v] ?6 ?5 ?4 ?3 ?2 ?1 0 high- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = low 0.0 0.5 1.0 1.5 2.0 2.5 3.0 high- level output voltage [v] ?50 ?40 ?30 ?20 ?10 0 high- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = standard 0.0 0.5 1.0 1.5 2.0 2.5 3.0 high- level output voltage [v] ?50 ?40 ?30 ?20 ?10 0 high- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = high
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 25 www.silabs.com figure 3.18. typical low-level output current, 3.8v supply voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 low- level output voltage [v] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 low- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = lowest 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 low- level output voltage [v] 0 2 4 6 8 10 12 14 low- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = low 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 low- level output voltage [v] 0 10 20 30 40 50 low- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = standard 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 low- level output voltage [v] 0 10 20 30 40 50 low- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = high
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 26 www.silabs.com figure 3.19. typical high-level output current, 3.8v supply voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 high- level output voltage [v] ?0.8 ?0.7 ?0.6 ?0.5 ?0.4 ?0.3 ?0.2 ?0.1 0.0 high- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = lowest 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 high- level output voltage [v] ?9 ?8 ?7 ?6 ?5 ?4 ?3 ?2 ?1 0 high- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = low 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 high- level output voltage [v] ?50 ?40 ?30 ?20 ?10 0 high- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = standard 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 high- level output voltage [v] ?50 ?40 ?30 ?20 ?10 0 high- level output current [m a] - 40c 25c 85c gpio_px_ctrl drivemode = high
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 27 www.silabs.com 3.9 oscillators 3.9.1 lfxo table 3.8. lfxo symbol parameter condition min typ max unit f lfxo supported nominal crystal frequency 32.768 khz esr lfxo supported crystal equivalent series re- sistance (esr) 30 120 kohm c lfxol supported crystal external load range 5 25 pf i lfxo current consump- tion for core and buffer after startup. esr=30 kohm, c l =10 pf, lfxoboost in cmu_ctrl is 1 190 na t lfxo start- up time. esr=30 kohm, c l =10 pf, 40% - 60% duty cycle has been reached, lfxoboost in cmu_ctrl is 1 1100 ms for safe startup of a given crystal, the energyaware designer in simplicity studio contains a tool to help users configure both load capacitance and software settings for using the lfxo. for details regarding the crystal configuration, the reader is referred to application note "an0016 efm32 oscillator design consideration". 3.9.2 hfxo table 3.9. hfxo symbol parameter condition min typ max unit f hfxo supported nominal crystal frequency 4 25 mhz crystal frequency 25 mhz 30 100 ohm esr hfxo supported crystal equivalent series re- sistance (esr) crystal frequency 4 mhz 400 1500 ohm g mhfxo the transconduc- tance of the hfxo input transistor at crystal startup hfxoboost in cmu_ctrl equals 0b11 20 ms c hfxol supported crystal external load range 5 25 pf 4 mhz: esr=400 ohm, c l =20 pf, hfxoboost in cmu_ctrl equals 0b11 85 a i hfxo current consump- tion for hfxo after startup 25 mhz: esr=30 ohm, c l =10 pf, hfxoboost in cmu_ctrl equals 0b11 165 a t hfxo startup time 25 mhz: esr=30 ohm, c l =10 pf, hfxoboost in cmu_ctrl equals 0b11 785 s
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 28 www.silabs.com 3.9.3 lfrco table 3.10. lfrco symbol parameter condition min typ max unit f lfrco oscillation frequen- cy , v dd = 3.0 v, t amb =25c 31.3 32.768 34.3 khz t lfrco startup time not in- cluding software calibration 150 s i lfrco current consump- tion 361 na tunestep l- frco frequency step for lsb change in tuning value 1.5 % figure 3.20. calibrated lfrco frequency vs temperature and supply voltage 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 30 32 34 36 38 40 42 frequency [khz] - 40c 25c 85c ?40 ?15 5 25 45 65 85 tem perature [c] 30 32 34 36 38 40 42 frequency [khz] 2.0 v 3.0 v 3.8 v
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 29 www.silabs.com 3.9.4 hfrco table 3.11. hfrco symbol parameter condition min typ max unit 24 mhz frequency band 23.28 24.0 24.72 mhz 21 mhz frequency band 20.37 21.0 21.63 mhz 14 mhz frequency band 13.58 14.0 14.42 mhz 11 mhz frequency band 10.67 11.0 11.33 mhz 7 mhz frequency band 6.40 6.60 6.80 mhz f hfrco oscillation frequen- cy, v dd = 3.0 v, t amb =25c 1 mhz frequency band 1.15 1.20 1.25 mhz t hfrco_settling settling time after start-up f hfrco = 14 mhz 0.6 cycles f hfrco = 24 mhz 158 184 a f hfrco = 21 mhz 143 175 a f hfrco = 14 mhz 113 140 a f hfrco = 11 mhz 101 125 a f hfrco = 6.6 mhz 84 105 a i hfrco current consump- tion f hfrco = 1.2 mhz 27 40 a tunestep h- frco frequency step for lsb change in tuning value 0.3 1 % 1 the tuning field in the cmu_hfrcoctrl register may be used to adjust the hfrco frequency. there is enough adjustment range to ensure that the frequency bands above 7 mhz will always have some overlap across supply voltage and temperature. by using a stable frequency reference such as the lfxo or hfxo, a firmware calibration routine can vary the tuning bits and the frequency band to maintain the hfrco frequency at any arbitrary value between 7 mhz and 21 mhz across operating conditions. figure 3.21. calibrated hfrco 1 mhz band frequency vs supply voltage and temperature 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 1.05 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 frequency [mhz] - 40c 25c 85c ?40 ?15 5 25 45 65 85 tem perature [c] 1.05 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 frequency [mhz] 2.0 v 3.0 v 3.8 v
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 30 www.silabs.com figure 3.22. calibrated hfrco 7 mhz band frequency vs supply voltage and temperature 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 6.30 6.35 6.40 6.45 6.50 6.55 6.60 6.65 6.70 frequency [mhz] - 40c 25c 85c ?40 ?15 5 25 45 65 85 tem perature [c] 6.30 6.35 6.40 6.45 6.50 6.55 6.60 6.65 6.70 frequency [mhz] 2.0 v 3.0 v 3.8 v figure 3.23. calibrated hfrco 11 mhz band frequency vs supply voltage and temperature 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 10.6 10.7 10.8 10.9 11.0 11.1 11.2 frequency [mhz] - 40c 25c 85c ?40 ?15 5 25 45 65 85 tem perature [c] 10.6 10.7 10.8 10.9 11.0 11.1 11.2 frequency [mhz] 2.0 v 3.0 v 3.8 v figure 3.24. calibrated hfrco 14 mhz band frequency vs supply voltage and temperature 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 13.4 13.5 13.6 13.7 13.8 13.9 14.0 14.1 14.2 frequency [mhz] - 40c 25c 85c ?40 ?15 5 25 45 65 85 tem perature [c] 13.4 13.5 13.6 13.7 13.8 13.9 14.0 14.1 14.2 frequency [mhz] 2.0 v 3.0 v 3.8 v
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 31 www.silabs.com figure 3.25. calibrated hfrco 21 mhz band frequency vs supply voltage and temperature 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 vdd [v] 20.2 20.4 20.6 20.8 21.0 21.2 frequency [mhz] - 40c 25c 85c ?40 ?15 5 25 45 65 85 tem perature [c] 20.2 20.4 20.6 20.8 21.0 21.2 frequency [mhz] 2.0 v 3.0 v 3.8 v 3.9.5 auxhfrco table 3.12. auxhfrco symbol parameter condition min typ max unit 21 mhz frequency band 20.37 21.0 21.63 mhz 14 mhz frequency band 13.58 14.0 14.42 mhz 11 mhz frequency band 10.67 11.0 11.33 mhz 7 mhz frequency band 6.40 6.60 6.80 mhz f auxhfrco oscillation frequen- cy, v dd = 3.0 v, t amb =25c 1 mhz frequency band 1.15 1.20 1.25 mhz t auxhfrco_settling settling time after start-up f auxhfrco = 14 mhz 0.6 cycles tunestep aux- hfrco frequency step for lsb change in tuning value 0.3 % 3.9.6 ushfrco table 3.13. ushfrco symbol parameter condition min typ max unit no clock recovery, full tem- perature and supply range 47.10 48.00 48.90 mhz no clock recovery, 25c, 3.3v 47.50 48.00 48.50 mhz f ushfrco oscillation frequen- cy usb active with clock recov- ery, full temperature and sup- ply range 47.88 48.00 48.12 mhz tc ushfrco temperature coeffi- cient 3.3v 0.0175 %/c vc ushfrco supply voltage co- efficient 25c 0.0045 %/v
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 32 www.silabs.com 3.9.7 ulfrco table 3.14. ulfrco symbol parameter condition min typ max unit f ulfrco oscillation frequen- cy 25c, 3v 0.70 1.75 khz tc ulfrco temperature coeffi- cient 0.05 %/c vc ulfrco supply voltage co- efficient -18.2 %/v 3.10 analog comparator (acmp) table 3.15. acmp symbol parameter condition min typ max unit v acmpin input voltage range 0 v dd v v acmpcm acmp common mode voltage range 0 v dd v biasprog=0b0000, full- bias=0 and halfbias=1 in acmpn_ctrl register 0.1 0.4 a biasprog=0b1111, full- bias=0 and halfbias=0 in acmpn_ctrl register 2.87 15 a i acmp active current biasprog=0b1111, full- bias=1 and halfbias=0 in acmpn_ctrl register 195 520 a internal voltage reference off. using external voltage refer- ence 0 a i acmpref current consump- tion of internal volt- age reference internal voltage reference 5 a v acmpoffset offset voltage biasprog= 0b1010, full- bias=0 and halfbias=0 in acmpn_ctrl register -12 0 12 mv v acmphyst acmp hysteresis programmable 17 mv csressel=0b00 in acmpn_inputsel 40 kohm csressel=0b01 in acmpn_inputsel 70 kohm csressel=0b10 in acmpn_inputsel 101 kohm r csres capacitive sense internal resistance csressel=0b11 in acmpn_inputsel 132 kohm t acmpstart startup time 10 s the total acmp current is the sum of the contributions from the acmp and its internal voltage reference as given in equation 3.1 (p. 32 ) . i acmpref is zero if an external voltage reference is used. total acmp active current
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 33 www.silabs.com i acmptotal = i acmp + i acmpref (3.1) figure 3.26. acmp characteristics, vdd = 3v, temp = 25c, fullbias = 0, halfbias = 1 0 4 8 12 acmp_ctrl_biasprog 0.0 0.5 1.0 1.5 2.0 2.5 current [ua] current consumption, hystsel = 4 0 2 4 6 8 10 12 14 acmp_ctrl_biasprog 0 5 10 15 20 response tim e [us] hystsel= 0 hystsel= 2 hystsel= 4 hystsel= 6 response time , v cm = 1.25v, cp+ to cp- = 100mv 0 1 2 3 4 5 6 7 acmp_ctrl_hystsel 0 20 40 60 80 100 hysteresis [m v] biasprog= 0.0 biasprog= 4.0 biasprog= 8.0 biasprog= 12.0 hysteresis
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 34 www.silabs.com 3.11 voltage comparator (vcmp) table 3.16. vcmp symbol parameter condition min typ max unit v vcmpin input voltage range v dd v v vcmpcm vcmp common mode voltage range v dd v biasprog=0b0000 and halfbias=1 in vcmpn_ctrl register 0.2 a i vcmp active current biasprog=0b1111 and halfbias=0 in vcmpn_ctrl register. lpref=0. 22 35 a t vcmpref startup time refer- ence generator normal 10 s single ended 10 mv v vcmpoffset offset voltage differential 10 mv v vcmphyst vcmp hysteresis 17 mv t vcmpstart startup time 10 s the v dd trigger level can be configured by setting the triglevel field of the vcmp_ctrl register in accordance with the following equation: vcmp trigger level as a function of level setting v dd trigger level =1.667v+0.034 triglevel (3.2) 3.12 i2c table 3.17. i2c standard-mode (sm) symbol parameter min typ max unit f scl scl clock frequency 0 100 1 khz t low scl clock low time 4.7 s t high scl clock high time 4.0 s t su,dat sda set-up time 250 ns t hd,dat sda hold time 8 3450 2 , 3 ns t su,sta repeated start condition set-up time 4.7 s t hd,sta (repeated) start condition hold time 4.0 s t su,sto stop condition set-up time 4.0 s t buf bus free time between a stop and start condition 4.7 s 1 for the minimum hfperclk frequency required in standard-mode, see the i2c chapter in the efm32hg reference manual. 2 the maximum sda hold time (t hd,dat ) needs to be met only when the device does not stretch the low time of scl (t low ). 3 when transmitting data, this number is guaranteed only when i2cn_clkdiv < ((3450*10 -9 [s] * f hfperclk [hz]) - 5).
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 35 www.silabs.com table 3.18. i2c fast-mode (fm) symbol parameter min typ max unit f scl scl clock frequency 0 400 1 khz t low scl clock low time 1.3 s t high scl clock high time 0.6 s t su,dat sda set-up time 100 ns t hd,dat sda hold time 8 900 2 , 3 ns t su,sta repeated start condition set-up time 0.6 s t hd,sta (repeated) start condition hold time 0.6 s t su,sto stop condition set-up time 0.6 s t buf bus free time between a stop and start condition 1.3 s 1 for the minimum hfperclk frequency required in fast-mode, see the i2c chapter in the efm32hg reference manual. 2 the maximum sda hold time (t hd,dat ) needs to be met only when the device does not stretch the low time of scl (t low ). 3 when transmitting data, this number is guaranteed only when i2cn_clkdiv < ((900*10 -9 [s] * f hfperclk [hz]) - 5). table 3.19. i2c fast-mode plus (fm+) symbol parameter min typ max unit f scl scl clock frequency 0 1000 1 khz t low scl clock low time 0.5 s t high scl clock high time 0.26 s t su,dat sda set-up time 50 ns t hd,dat sda hold time 8 ns t su,sta repeated start condition set-up time 0.26 s t hd,sta (repeated) start condition hold time 0.26 s t su,sto stop condition set-up time 0.26 s t buf bus free time between a stop and start condition 0.5 s 1 for the minimum hfperclk frequency required in fast-mode plus, see the i2c chapter in the efm32hg reference manual. 3.13 digital peripherals table 3.20. digital peripherals symbol parameter condition min typ max unit i usart usart current usart idle current, clock en- abled 7.5 a/ mhz i leuart leuart current leuart idle current, clock en- abled 150 na i i2c i2c current i2c idle current, clock enabled 6.25 a/ mhz i timer timer current timer_0 idle current, clock enabled 8.75 a/ mhz i pcnt pcnt current pcnt idle current, clock en- abled 100 na i rtc rtc current rtc idle current, clock enabled 100 na
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 36 www.silabs.com symbol parameter condition min typ max unit i gpio gpio current gpio idle current, clock en- abled 5.31 a/ mhz i prs prs current prs idle current 2.81 a/ mhz i dma dma current clock enable 8.12 a/ mhz
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 37 www.silabs.com 4 pinout and package note please refer to the application note "an0002 efm32 hardware design considerations" for guidelines on designing printed circuit boards (pcb's) for the efm32hg108. 4.1 pinout the efm32hg108 pinout is shown in figure 4.1 (p. 37 ) and table 4.1 (p. 37 ) . alternate locations are denoted by "#" followed by the location number (multiple locations on the same pin are split with "/"). alternate locations can be configured in the location bitfield in the *_route register in the module in question. figure 4.1. efm32hg108 pinout (top view, not to scale) table 4.1. device pinout qfn24 pin# and name pin alternate functionality / description pin # pin name analog timers communication other 0 vss ground. 1 pa0 tim0_cc1 #6 tim0_cc0 #0/1/4 pcnt0_s0in #4 us1_rx #4 leu0_rx #4 i2c0_sda #0 prs_ch0 #0 prs_ch3 #3 gpio_em4wu0
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 38 www.silabs.com qfn24 pin# and name pin alternate functionality / description pin # pin name analog timers communication other 2 iovdd_0 digital io power supply 0. 3 pc0 acmp0_ch0 tim0_cc1 #4 pcnt0_s0in #2 us0_tx #5/6 us1_tx #0 us1_cs #5 i2c0_sda #4 prs_ch2 #0 4 pc1 acmp0_ch1 tim0_cc2 #4 pcnt0_s1in #2 us0_rx #5/6 us1_tx #5 us1_rx #0 i2c0_scl #4 prs_ch3 #0 5 pb7 lfxtal_p tim1_cc0 #3 us0_tx #4 us1_clk #0 6 pb8 lfxtal_n tim1_cc1 #3 us0_rx #4 us1_cs #0 7 resetn reset input, active low. to apply an external reset source to this pin, it is required to only drive this pin low during reset, and let the internal pull-up ensure that reset is released. 8 pb11 tim1_cc2 #3 pcnt0_s1in #4 us1_clk #4 cmu_clk1 #3 acmp0_o #3 9 avdd_2 analog power supply 2. 10 pb13 hfxtal_p us0_clk #4/5 leu0_tx #1 11 pb14 hfxtal_n us0_cs #4/5 leu0_rx #1 12 avdd_0 analog power supply 0. 13 pd6 tim1_cc0 #4 pcnt0_s0in #3 us1_rx #2/3 i2c0_sda #1 acmp0_o #2 14 pd7 tim1_cc1 #4 pcnt0_s1in #3 us1_tx #2/3 i2c0_scl #1 cmu_clk0 #2 15 vdd_dreg power supply for on-chip voltage regulator. 16 decouple decouple output for on-chip voltage regulator. an external capacitance of size c decouple is required at this pin. 17 pc14 tim0_cdti1 #1/6 tim1_cc1 #0 pcnt0_s1in #0 us0_cs #3 us1_cs #3/4 leu0_tx #5 prs_ch0 #2 18 pc15 tim0_cdti2 #1/6 tim1_cc2 #0 us0_clk #3 us1_clk #3 leu0_rx #5 prs_ch1 #2 19 pf0 tim0_cc0 #5 us1_clk #2 leu0_tx #3 i2c0_sda #5 dbg_swclk #0 boot_tx 20 pf1 tim0_cc1 #5 us1_cs #2 leu0_rx #3 i2c0_scl #5 dbg_swdio #0 gpio_em4wu3 boot_rx 21 pf2 tim0_cc2 #5/6 tim2_cc0 #3 us1_tx #4 leu0_tx #4 cmu_clk0 #3 prs_ch0 #3 gpio_em4wu4 22 iovdd_5 digital io power supply 5. 23 pe12 tim1_cc2 #1 tim2_cc1 #3 us0_rx #3 us0_clk #0/6 i2c0_sda #6 cmu_clk1 #2 prs_ch1 #3 24 pe13 tim2_cc2 #3 us0_tx #3 us0_cs #0/6 i2c0_scl #6 acmp0_o #0 prs_ch2 #3 gpio_em4wu5
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 39 www.silabs.com 4.2 alternate functionality pinout a wide selection of alternate functionality is available for multiplexing to various pins. this is shown in table 4.2 (p. 39 ) . the table shows the name of the alternate functionality in the first column, followed by columns showing the possible location bitfield settings. note some functionality, such as analog interfaces, do not have alternate settings or a loca- tion bitfield. in these cases, the pinout is shown in the column corresponding to loca- tion 0. table 4.2. alternate functionality overview alternate location functionality 0 1 2 3 4 5 6 description acmp0_ch0 pc0 analog comparator acmp0, channel 0. acmp0_ch1 pc1 analog comparator acmp0, channel 1. acmp0_o pe13 pd6 pb11 analog comparator acmp0, digital output. boot_rx pf1 bootloader rx. boot_tx pf0 bootloader tx. cmu_clk0 pd7 pf2 clock management unit, clock output number 0. cmu_clk1 pe12 pb11 clock management unit, clock output number 1. dbg_swclk pf0 debug-interface serial wire clock input. note that this function is enabled to pin out of reset, and has a built-in pull down. dbg_swdio pf1 debug-interface serial wire data input / output. note that this function is enabled to pin out of reset, and has a built-in pull up. gpio_em4wu0 pa0 pin can be used to wake the system up from em4 gpio_em4wu3 pf1 pin can be used to wake the system up from em4 gpio_em4wu4 pf2 pin can be used to wake the system up from em4 gpio_em4wu5 pe13 pin can be used to wake the system up from em4 hfxtal_n pb14 high frequency crystal negative pin. also used as external optional clock input pin. hfxtal_p pb13 high frequency crystal positive pin. i2c0_scl pd7 pc1 pf1 pe13 i2c0 serial clock line input / output. i2c0_sda pa0 pd6 pc0 pf0 pe12 i2c0 serial data input / output. leu0_rx pb14 pf1 pa0 pc15 leuart0 receive input. leu0_tx pb13 pf0 pf2 pc14 leuart0 transmit output. also used as receive input in half duplex communication. lfxtal_n pb8 low frequency crystal (typically 32.768 khz) negative pin. also used as an optional external clock input pin. lfxtal_p pb7 low frequency crystal (typically 32.768 khz) positive pin. pcnt0_s0in pc0 pd6 pa0 pulse counter pcnt0 input number 0. pcnt0_s1in pc14 pc1 pd7 pb11 pulse counter pcnt0 input number 1. prs_ch0 pa0 pc14 pf2 peripheral reflex system prs, channel 0. prs_ch1 pc15 pe12 peripheral reflex system prs, channel 1. prs_ch2 pc0 pe13 peripheral reflex system prs, channel 2.
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 40 www.silabs.com alternate location functionality 0 1 2 3 4 5 6 description prs_ch3 pc1 pa0 peripheral reflex system prs, channel 3. tim0_cc0 pa0 pa0 pa0 pf0 timer 0 capture compare input / output channel 0. tim0_cc1 pc0 pf1 pa0 timer 0 capture compare input / output channel 1. tim0_cc2 pc1 pf2 pf2 timer 0 capture compare input / output channel 2. tim0_cdti1 pc14 pc14 timer 0 complimentary deat time insertion channel 1. tim0_cdti2 pc15 pc15 timer 0 complimentary deat time insertion channel 2. tim1_cc0 pb7 pd6 timer 1 capture compare input / output channel 0. tim1_cc1 pc14 pb8 pd7 timer 1 capture compare input / output channel 1. tim1_cc2 pc15 pe12 pb11 timer 1 capture compare input / output channel 2. tim2_cc0 pf2 timer 2 capture compare input / output channel 0. tim2_cc1 pe12 timer 2 capture compare input / output channel 1. tim2_cc2 pe13 timer 2 capture compare input / output channel 2. us0_clk pe12 pc15 pb13 pb13 pe12 usart0 clock input / output. us0_cs pe13 pc14 pb14 pb14 pe13 usart0 chip select input / output. us0_rx pe12 pb8 pc1 pc1 usart0 asynchronous receive. usart0 synchronous mode master input / slave output (miso). us0_tx pe13 pb7 pc0 pc0 usart0 asynchronous transmit.also used as receive input in half duplex communication. usart0 synchronous mode master output / slave input (mosi). us1_clk pb7 pf0 pc15 pb11 usart1 clock input / output. us1_cs pb8 pf1 pc14 pc14 pc0 usart1 chip select input / output. us1_rx pc1 pd6 pd6 pa0 usart1 asynchronous receive. usart1 synchronous mode master input / slave output (miso). us1_tx pc0 pd7 pd7 pf2 pc1 usart1 asynchronous transmit.also used as receive input in half duplex communication. usart1 synchronous mode master output / slave input (mosi). 4.3 gpio pinout overview the specific gpio pins available in efm32hg108 is shown in table 4.3 (p. 40 ) . each gpio port is organized as 16-bit ports indicated by letters a through f, and the individual pin on this port is indicated by a number from 15 down to 0. table 4.3. gpio pinout port pin 15 pin 14 pin 13 pin 12 pin 11 pin 10 pin 9 pin 8 pin 7 pin 6 pin 5 pin 4 pin 3 pin 2 pin 1 pin 0 port a - - - - - - - - - - - - - - - pa0 port b - pb14 pb13 - pb11 - - pb8 pb7 - - - - - - - port c pc15 pc14 - - - - - - - - - - - - pc1 pc0 port d - - - - - - - - pd7 pd6 - - - - - - port e - - pe13 pe12 - - - - - - - - - - - - port f - - - - - - - - - - - - - pf2 pf1 pf0
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 41 www.silabs.com 4.4 qfn24 package figure 4.2. qfn24 note: 1. dimensioning & tolerancing confirm to asme y14.5m-1994. 2. all dimensions are in millimeters. angles are in degrees. 3. dimension 'b' applies to metallized terminal and is measured between 0.25 mm and 0.30 mm from the terminal tip. dimension l1 represents terminal full back from package edge up to 0.1 mm is acceptable. 4. coplanarity applies to the exposed heat slug as well as the terminal. 5. radius on terminal is optional table 4.4. qfn24 (dimensions in mm) symbol a a1 a3 b d e d2 e2 e l l1 aaa bbb ccc ddd eee min 0.80 0.00 0.25 3.50 3.50 0.35 0.00 nom 0.85 - 0.30 3.60 3.60 0.40 max 0.90 0.05 0.203 ref 0.35 5.00 bsc 5.00 bsc 3.70 3.70 0.65 bsc 0.45 0.10 0.10 0.10 0.10 0.05 0.08 the qfn24 package uses matte-sn post plated leadframe. all efm32 packages are rohs compliant and free of bromine (br) and antimony (sb). for additional quality and environmental information, please see: http://www.silabs.com/support/quality/pages/default.aspx
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 42 www.silabs.com 5 pcb layout and soldering 5.1 recommended pcb layout figure 5.1. qfn24 pcb land pattern e a d p1 p2 p3 p4 p5 p6 p7 p8 c b p9 f g table 5.1. qfn24 pcb land pattern dimensions (dimensions in mm) symbol dim. (mm) symbol pin number symbol pin number a 0.80 p1 1 p8 24 b 0.30 p2 6 p9 25 c 0.65 p3 7 - - d 5.00 p4 12 - - e 5.00 p5 13 - - f 3.60 p6 18 - - g 3.60 p7 19 - -
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 43 www.silabs.com figure 5.2. qfn24 pcb solder mask e a d c b f g table 5.2. qfn24 pcb solder mask dimensions (dimensions in mm) symbol dim. (mm) symbol dim. (mm) a 0.92 e 5.00 b 0.42 f 3.72 c 0.65 g 3.72 d 5.00 - -
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 44 www.silabs.com figure 5.3. qfn24 pcb stencil design e a d c b x y z table 5.3. qfn24 pcb stencil design dimensions (dimensions in mm) symbol dim. (mm) symbol dim. (mm) a 0.60 e 5.00 b 0.25 x 1.00 c 0.65 y 1.00 d 5.00 z 0.50 1. the drawings are not to scale. 2. all dimensions are in millimeters. 3. all drawings are subject to change without notice. 4. the pcb land pattern drawing is in compliance with ipc-7351b. 5. stencil thickness 0.125 mm. 6. for detailed pin-positioning, see figure 4.2 (p. 41 ) . 5.2 soldering information the latest ipc/jedec j-std-020 recommendations for pb-free reflow soldering should be followed. place as many and as small as possible vias underneath each of the solder patches under the ground pad.
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 45 www.silabs.com 6 chip marking, revision and errata 6.1 chip marking in the illustration below package fields and position are shown. figure 6.1. example chip marking (top view) 6.2 revision the revision of a chip can be determined from the "revision" field in figure 6.1 (p. 45 ) . 6.3 errata please see the errata document for efm32hg108 for description and resolution of device erratas. this document is available in simplicity studio and online at: http://www.silabs.com/support/pages/document-library.aspx?p=mcus--32-bit
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 46 www.silabs.com 7 revision history 7.1 revision 0.91 may 6th, 2015 updated current consumption table for energy modes. updated gpio max leakage current. updated startup time for hfxo and lfxo. updated current consumption for hfrco and lfrco. updated adc current consumption. updated idac characteristics tables. updated acmp internal resistance. updated vcmp current consumption. 7.2 revision 0.90 march 16th, 2015 note this datasheet revision applies to a product under development. it?s characteristics and specifications are subject to change without notice. corrected em2 current consumption condition in electrical characteristics section. updated gpio electrical characteristics. updated max esr hfxo value for crystal frequency of 25 mhz. updated lfrco plots. updated hfrco table and plots. updated adc table and temp sensor plot. added dma current in digital peripherals section. updated block diagram. updated package dimensions table. corrected leadframe type to matte-sn. 7.3 revision 0.20 december 11th, 2014 preliminary release.
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 47 www.silabs.com a disclaimer and trademarks a.1 disclaimer silicon laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the silicon laboratories products. characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "typical" parameters provided can and do vary in different applications. application examples described herein are for illustrative purposes only. silicon laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. silicon laboratories shall have no liability for the conse- quences of use of the information supplied herein. this document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. the products must not be used within any life support system without the specific written consent of silicon laboratories. a "life support system" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. silicon laboratories products are generally not intended for military applications. silicon laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. a.2 trademark information silicon laboratories inc., silicon laboratories, silicon labs, silabs and the silicon labs logo, cmems?, efm, efm32, efr, energy micro, energy micro logo and combinations thereof, "the world?s most ener- gy friendly microcontrollers", ember?, ezlink?, ezmac?, ezradio?, ezradiopro?, dspll?, iso- modem?, precision32?, proslic?, siphy?, usbxpress? and others are trademarks or registered trademarks of silicon laboratories inc. arm, cortex, cortex-m3 and thumb are trademarks or reg- istered trademarks of arm holdings. keil is a registered trademark of arm limited. all other products or brand names mentioned herein are trademarks of their respective holders.
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 48 www.silabs.com b contact information silicon laboratories inc. 400 west cesar chavez austin, tx 78701 please visit the silicon labs technical support web page: http://www.silabs.com/support/pages/contacttechnicalsupport.aspx and register to submit a technical support request.
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 49 www.silabs.com table of contents 1. ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2. system summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.1. system introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.2. configuration summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3. memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3. electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1. test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.3. general operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.4. current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.5. transition between energy modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.6. power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.7. flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.8. general purpose input output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.9. oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.10. analog comparator (acmp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 3.11. voltage comparator (vcmp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.12. i2c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.13. digital peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 4. pinout and package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 4.1. pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 4.2. alternate functionality pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 4.3. gpio pinout overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 4.4. qfn24 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5. pcb layout and soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 5.1. recommended pcb layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 5.2. soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 6. chip marking, revision and errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 6.1. chip marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 6.2. revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 6.3. errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 7. revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 7.1. revision 0.91 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 7.2. revision 0.90 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 7.3. revision 0.20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 a. disclaimer and trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 a.1. disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 a.2. trademark information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 b. contact information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 b.1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 50 www.silabs.com list of figures 2.1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.2. efm32hg108 memory map with largest ram and flash sizes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1. em0 current consumption while executing prime number calculation code from flash with hfrco running at 24 mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.2. em0 current consumption while executing prime number calculation code from flash with hfrco running at 21 mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.3. em0 current consumption while executing prime number calculation code from flash with hfrco running at 14 mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4. em0 current consumption while executing prime number calculation code from flash with hfrco running at 11 mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.5. em0 current consumption while executing prime number calculation code from flash with hfrco running at 6.6 mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.6. em1 current consumption with all peripheral clocks disabled and hfrco running at 24 mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.7. em1 current consumption with all peripheral clocks disabled and hfrco running at 21 mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.8. em1 current consumption with all peripheral clocks disabled and hfrco running at 14 mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.9. em1 current consumption with all peripheral clocks disabled and hfrco running at 11 mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.10. em1 current consumption with all peripheral clocks disabled and hfrco running at 6.6 mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.11. em2 current consumption. rtc prescaled to 1khz, 32.768 khz lfrco. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.12. em3 current consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.13. em4 current consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.14. typical low-level output current, 2v supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.15. typical high-level output current, 2v supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.16. typical low-level output current, 3v supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.17. typical high-level output current, 3v supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.18. typical low-level output current, 3.8v supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.19. typical high-level output current, 3.8v supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.20. calibrated lfrco frequency vs temperature and supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.21. calibrated hfrco 1 mhz band frequency vs supply voltage and temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.22. calibrated hfrco 7 mhz band frequency vs supply voltage and temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.23. calibrated hfrco 11 mhz band frequency vs supply voltage and temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.24. calibrated hfrco 14 mhz band frequency vs supply voltage and temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.25. calibrated hfrco 21 mhz band frequency vs supply voltage and temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 3.26. acmp characteristics, vdd = 3v, temp = 25c, fullbias = 0, halfbias = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 4.1. efm32hg108 pinout (top view, not to scale) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 4.2. qfn24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5.1. qfn24 pcb land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 5.2. qfn24 pcb solder mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 5.3. qfn24 pcb stencil design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 6.1. example chip marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 51 www.silabs.com list of tables 1.1. ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1. configuration summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.1. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2. general operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.3. current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.4. energy modes transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.5. power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.6. flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.7. gpio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.8. lfxo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.9. hfxo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.10. lfrco . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.11. hfrco . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.12. auxhfrco . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 3.13. ushfrco . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 3.14. ulfrco . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 3.15. acmp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 3.16. vcmp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.17. i2c standard-mode (sm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.18. i2c fast-mode (fm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 3.19. i2c fast-mode plus (fm+) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 3.20. digital peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 4.1. device pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 4.2. alternate functionality overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 4.3. gpio pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 4.4. qfn24 (dimensions in mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5.1. qfn24 pcb land pattern dimensions (dimensions in mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 5.2. qfn24 pcb solder mask dimensions (dimensions in mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 5.3. qfn24 pcb stencil design dimensions (dimensions in mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
preliminary ...the world's most energy friendly microcontrollers 2015-05-06 - efm32hg108fxx - _rev0.91 52 www.silabs.com list of equations 3.1. total acmp active current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 3.2. vcmp trigger level as a function of level setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

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